Cov khoom muag
Zoo-Tech muaj 8-nti thiab 12-nti RIBS systems, uas sib txuas lub cev sputtering (los ntawm ib txwm IBS) nrog cov pa roj reactive rau cov khoom siv zoo.
Common Design:Plasma tiam yog sib cais los ntawm thaj chaw wafer kom tsis txhob muaj kev cuam tshuam tsis zoo ntawm cov khoom lag luam; ob leeg txhawb nqa theem qaij / kev sib hloov thiab ib leeg / pawg chamber teeb.
Qhov txawv:Lub 12-inch yog haum rau 12-inch wafer loj ntau lawm nrog ib tug loj-inch ion qhov chaw; lub 8-nti yog sib xws nrog 8/6/4-inch wafers, zoo tagnrho rau nruab nrab-me me ntau lawm thiab R & D.
Qhov zoo
Common Advantages
- Boosted efficiency & precision: Blending physics thiab chemistry elevates tus nqi tshem tawm cov khoom thiab daim npog qhov ncauj xaiv. Kev tswj hwm ywj pheej ntawm ion beam zog thiab flux ua kom pom tseeb, raug qauv morphologies.
- Cov txheej txheem hloov tau yooj yim: Theem qaij thaj tsam ntawm -90℃mus rau +80℃rau lub kaum sab xis ntawm lub kaum sab xis. Rotatable theem txhim kho uniformity, zoo kawg nkaus haum rau tshwj xeeb-zoo li tus ntaus ntawv raug.
- Kev sib raug zoo ntawm cov khoom siv dav: Ua haujlwm seamlessly nrog hlau, alloys, oxides, thiab compound semiconductors-tackling txawm cov ntaub ntawv nyuaj tshaj plaws kev sib tw.
Differentiated Advantages
- 12-inch: Nta ib qhov loj-inch ion qhov chaw xa khoom<1% etch uniformity (1σ). Ideal for high-precision 12-inch advanced processes.
- 8-nti: Muab<3% uniformity in a compact, cost-effective design. Compatible with multi-size wafers, making it perfect for mature nodes and R&D projects.
Daim ntawv thov
Cov ntawv thov siv
1. Cov qauv kho qhov muag tshwj xeeb: Muab cov hlua khi thiab blazed gratings-peb kev lag luam- muaj peev xwm ua tau - rau kev sib txuas lus kho qhov muag thiab laser technologies.
2. Cov khoom siv semiconductor nyuaj: Cov qauv ntau- txheej txheej hlau pawg thiab heterojunctions, lav cov cuab yeej txhim khu kev qha hauv siab - thov kev thov.
3. High-cov sensors precision: Fabricates MEMS thiab optical sensors nrog ultra- microstructures raug, ncaj qha boosting sensor rhiab heev thiab ua hauj lwm stability.
Daim ntawv thov sib txawv
1. 12-inch: Lub hauv paus pob zeb rau 12-inch siab ntau lawm kab-xav MRAM/PCRAM ua haujlwm txheej thiab silicon photonics chips. Seamlessly integrates nrog 12-nti manufacturing workflows uas twb muaj lawm.
2. 8-inch: Zoo tagnrho rau 8-inch mature nodes (Ntau dua lossis sib npaug ntawm 0.11μm) thiab R&D cov haujlwm, xws li cov khoom siv kho qhov muag me me thiab MEMS tshwj xeeb. Txhawb kev hloov pauv hloov pauv hloov pauv hloov pauv kom haum rau ntau yam kev xav tau.
Tsis muaj
|
Qeb |
8-nti RIBS System |
12-nti RIBS System |
|
Wafer Compatibility |
8-nti (thawj); 6-nti / 4-nti (yeem, ntawm cov electrodes tau tshaj) |
12-nti (tsuas yog) |
|
Uniformity (1σ) |
<3% (standard ion source configuration) |
<1% (large-diameter ion source as standard, for high-precision 12-inch wafer processing) |
|
Ion Beam Tswj |
Kev ywj pheej hloov ntawm ion beam zog thiab flux (ua kom raug kho ntawm cov qauv hauv qab lub kaum sab xis thiab flatness) |
Kev ywj pheej hloov ntawm ion beam zog thiab flux (kom tswj tau qhov tseeb ntawm cov txheej txheem morphology) |
|
Theem Tilt Range |
-90℃rau +80℃(paub txog tilted ion beam tshwm sim rau sidewall lub kaum sab xis tswj) |
-90℃rau +80℃(txhawb qaij qhov xwm txheej kom ua tau raws li qhov xav tau ntawm phab ntsa nyuaj) |
|
Theem Function |
Rotatable thaum lub sij hawm txheej txheem (txhim kho cov txheej txheem axisymmetry thiab nyob rau hauv -wafer uniformity) |
Rotatable thaum lub sij hawm txheej txheem (ua kom zoo ua haujlwm zoo thoob plaws 12-nti wafers) |
|
Txheej Txheem Ib puag ncig |
Siab - ib puag ncig lub tshuab nqus tsev (txo qis ambient cuam tshuam, ua kom ruaj khov tshuaj tiv thaiv thiab sputtering) |
High - ib puag ncig lub tshuab nqus tsev (tseem ntseeg tau kev sib koom ua ke ntawm lub cev sputtering thiab tshuaj tiv thaiv) |
|
Chamber Configuration |
Ib leeg-chamber lossis pawg teeb tsa (yeem, haum rau me me - nruab nrab ntau lawm thiab R&D) |
Integratable rau hauv ntau pawg kab ke (sib haum nrog loj - nplai 12-nti cov txheej txheem siab heev) |
|
Khoom Compatibility |
Hlau, alloys, oxides, compound semiconductors, insulators (kho cov khoom sib tw ua qauv sib tw) |
Hlau, alloys, oxides, compound semiconductors, thiab ntau -txheej txheej stacks (fits advanced device manufacturing xav tau) |
|
Core Application Scenarios |
8-inch mature process nodes (Ntau dua lossis sib npaug ntawm 0.11μm), mini optical sensors, tshwj xeeb MEMS R&D, me me-batch complex tivthaiv ntau lawm |
12- nti cov txheej txheem siab heev (xws li MRAM / PCRAM cov txheej txheem ua haujlwm), silicon photonics chips, loj- nplai high-precision semiconductor manufacturing |
FAQ
Q: Dab tsi yog qhov txawv ntawm 8-nti thiab 12-nti RIBS systems?
A: Lub 12-inch hom phiaj siab-precision 12-inch loj ntau lawm; lub 8-nti haum rau ntau qhov loj wafers (8/6/4-nti) rau cov neeg laus thiab R & D.
Q: Cov ntaub ntawv dab tsi lawv tuaj yeem ua tau?
A: Ob leeg tuav hlau, alloys, oxides, compound semiconductors, thiab insulators.
Q: Lawv puas tuaj yeem tsim cov qauv kho qhov muag tshwj xeeb?
A: Yog, ob qho tib si ua tau zoo ntawm slanted / blazed gratings nrog kev lag luam- muaj peev xwm ua tau.
Q: Puas yog cov tshuab ua tau zoo nrog cov kab ntau lawm?
A: Yog, ob qho tib si txhawb kev teeb tsa pawg thiab ua raws li cov qauv kev lag luam semiconductor rau kev sib koom ua ke yooj yim.
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