Cov khoom muag

Tsim los ntawm Nice-Tech, MSE 100 yog 12-inch kev sib xyaw ua ke tsim tshwj xeeb rau cov hlau tshwj xeeb etching-nws lub hom phiaj tseem ceeb yog los txhawb kev tsim cov xwm txheej ntawm cov khoom siv nco.

Qhov zoo tshaj plaws ntawm cov kab ke no nyob hauv nws lub peev xwm kev sib koom ua ke: nws ua ke Reactive Ion Etching (RIE), Ion Beam Shaping (IBS), thiab hauv -situ passivation txheej txheem rau hauv ib chav tsev. Thiab qhov laj thawj tseem ceeb ntawm kev tsim qauv no yog ua kom tau raws li qhov yuav tsum tau ua ntawm ntau hom kev sib tsoo hlau sib tsoo -xav Magnetic Tunnel Junctions (MTJs) hauv Magnetic Random Access Memory (MRAM), alloy theem hloov txheej txheej hauv Phase Hloov RAM (PCRAM), thiab cov pawg tiv thaiv hauv Resistive RAM (ReRAM). Cov no yog txhua qhov tseem ceeb hauv kev lag luam tam sim no.

Hom hlau pawg no feem ntau ua rau cov khoom tsis yog -volatile byproducts, ua qauv nyuaj heev- uas yog ib qho mob tsis tu ncua rau kev lag luam. LMEC -300™ daws qhov teeb meem no zoo kawg nkaus. Los ntawm kev siv cov txheej txheem kev sib xyaw ua ke hauv ib puag ncig lub tshuab nqus tsev, nws hla cov kev txwv ntawm cov txheej txheem ib txwm ua. Hais lus ncaj ncees, nws muab cov kev daws teeb meem zoo nkauj thiab txhim khu kev qha rau cov txheej txheem tsim khoom tseem ceeb ntawm cov khoom siv nco.

Qhov zoo

Integrated Vacuum Process

Nws yog txhua yam hais txog kev sib koom ua ke, kev tu kom qhuav, thiab hauv -situ passivation- li no, peb tuaj yeem nres cov phab ntsa hlau los ntawm oxidizing, thiab qhov ntawd ncaj qha muab cov cuab yeej kev ntseeg tau zoo.

Dual{0}}Technology Synergy

Thaum RIE thiab IBS ua haujlwm ua ke, tej yam zoo tshwm sim. RIE sidewall contamination? ploj mus. Cov kab dav txwv uas siv los tuav IBS rov qab? tawg dhau. Nws yog qhov yeej tiag tiag- yeej rau kev ua tau zoo.

Kev hloov kho yooj yim

Cov kab ke no muaj ntau yam zoo nkauj - nws ua haujlwm MRAM, PCRAM, ReRAM, thiab txawm tias sensors tsis muaj fuss. Thiab yog tias koj ntxiv qhov kev xaiv hardmask chamber? Koj tau txais tag nrho -hauv-ib qho kev daws teeb meem uas ua haujlwm rau cov nodes tsawg dua lossis sib npaug rau 55nm ib yam nkaus.

Mass -Production Ready

Nws kos lub thawv rau 12-inch wafer qauv, uas yog qhov tseem ceeb heev. Rau loj - cov kab ntau lawm, uas txhais tau hais tias kev ua tau zoo nyob ruaj khov thiab zoo ib yam-tsis muaj kev xav tsis thoob thaum koj nce.

Daim ntawv thov

Emerging memory manufacturing

Etching MTJs (MRAM), PCRAM theem hloov txheej, thiab ReRAM resistive pawg .

Tshwj xeeb hlau pawg ua

Etching non-volatile hlau/alloy stacks nrog complex compositions .

12- nti IC rov qab txheej txheem

Txhawb cov nodes siab heev uas yuav tsum tau siab - precision hlau etching thiab integrated hardmask tuav .

Tsis muaj

Qeb	Paub meej
Wafer Compatibility	12-inch (300mm) wafers; adaptable rau loj-loj wafer kev ua ke rau semiconductor loj ntau lawm
Chamber Configuration	3 core chambers: Chimera N RIE chamber, Pangea A IBS chamber, Basalt A hauv -situ deposition chamber; yeem Chimera Lub hardmask qhib chamber
Txheej Txheem Ib puag ncig	Tag nrho - nqus tsev - ua haujlwm kaw; zam ambient raug los tiv thaiv sidewall hlau oxidation thiab hydration
Cov ntaub ntawv hom phiaj	Complex tshwj xeeb hlau pawg (MRAM MTJs, PCRAM theem hloov txheej, ReRAM hlau-oxide- hlau tiv thaiv pawg)
Technology Nodes	Tau tshaj cov nodes nce mus txog 55nm; ua tau raws siab -precision patterning xav tau
Cov Txheej Txheem Tseem Ceeb	1. Ib qho - nres ua haujlwm (plasma etching, qhuav tu, hauv -situ passivation); 2. RIE-IBS kev sib koom ua ke rau kev sib kis thiab kab dav kev daws teeb meem; 3. Xaiv hardmask-rau-functional txheej integrated etching
Kev ua raws li kev lag luam	Txais 12-nti IC cov kab ntau lawm tus qauv; ua raws li SEMI cov qauv tsim; dhau qhov kev ntsuam xyuas nruj nruj