Cov txheej txheem tseem ceeb rau silicon wafer txiav suav nrog pob zeb diamond sib tsoo log txiav thiab laser txiav. Laser scribing yog cov txheej txheem ntawm kev siv high- lub zog laser beams tsom thiab tsim kom muaj qhov kub thiab txias, ua rau cov khoom siv silicon nyob rau hauv qhov chaw irradiated kom vaporize tam sim ntawd thiab ua kom tiav qhov sib cais ntawm silicon wafers. Txawm li cas los xij, qhov kub thiab txias tuaj yeem ua rau muaj kev ntxhov siab nyob ib puag ncig ntawm kev txiav seam, ua rau cov npoo tawg ntawm silicon wafer, thiab tsuas yog tsim rau scribing nyias wafers. Ultra nyias pob zeb diamond sib tsoo log txiav yog tam sim no feem ntau siv cov txheej txheem txiav vim nws tsis tshua muaj zog txiav thiab txiav nqi qis.
Vim tias qhov nkig thiab tawv ntawm silicon wafers, cov txheej txheem txiav yog qhov ua rau muaj qhov tsis xws luag xws li ntug tawg, microcracks, thiab delamination, uas cuam tshuam ncaj qha rau cov khoom siv ntawm silicon wafers. Nyob rau tib lub sijhawm, vim yog qhov nyuaj siab, tsis tshua muaj zog, thiab thermal conductivity ntawm silicon wafers, cov cua kub sib txhuam tsim thaum lub sij hawm txiav yog qhov nyuaj rau kev tawm sai sai, uas tuaj yeem ua rau carbonization thiab thermal tawg ntawm pob zeb diamond hais hauv cov hniav, ua rau cov cuab yeej hnyav hnyav thiab cuam tshuam rau kev txiav zoo.
Cov kws tshawb fawb hauv tsev thiab txawv teb chaws tau tshawb fawb ntau ntawm silicon wafer slicing tshuab. Zhang Hongchun et al. tsim kom muaj ib qho kev sib npaug ntawm kev vibration thiab txiav cov txheej txheem, thiab siv cov genetic algorithms kom tau txais cov txheej txheem zoo rau kev co me me. Lawv tau txheeb xyuas los ntawm kev sim ua kom pom kev sib xyaw ua ke ntawm cov txheej txheem tsis tuaj yeem txo qis kev vibration thiab ua tiav cov txiaj ntsig zoo dua. Li Zhencai et al. pom tias lub sawing quab yuam generated los ntawm ultrasonic kev co pab slicing yog me dua uas generated los ntawm ib tug siv lead ua silicon slicing tsis muaj kev pab cuam ultrasonic. Los ntawm silicon wafer slicing thwmsim, nws tau txheeb xyuas tias txo cov sawing quab yuam los ntawm ultrasonic kev co tuaj yeem cuam tshuam cov ntug tawg ntawm silicon wafers. Disco Corporation hauv Nyij Pooj tau tsim cov txheej txheem laser slotting los daws qhov teeb meem ntawm kev nyuaj hauv kev txiav qis -K dielectric silicon wafers siv cov pob zeb diamond zoo tib yam. Cov txheej txheem yog thawj zaug txiav ob qhov zoo nyob rau hauv txoj kev txiav, thiab tom qab ntawd siv cov hniav los ua tag nrho slicing ntawm ob grooves. Cov txheej txheem no tuaj yeem txhim kho kev tsim khoom thiab txo qhov tsis zoo los ntawm cov yam ntxwv xws li ntug kev tawg thiab delamination. Fudan University's Lu Xiong et al. siv laser slotting ua raws li cov neeg kho tshuab hniav txiav tshuab txiav qis -k dielectric silicon wafer cov ntaub ntawv. Piv nrog rau cov hniav ncaj ncaj txiav, cov qauv nti ua tiav thiab tsis muaj hlau txheej txheej los yog flipping tshwm sim, tab sis cov txheej txheem yog cumbersome thiab txiav nqi siab. Yu Zhang et al. pom tias los ntawm kev ua kom cov damping piv ntawm cov txheej txheem kev sib hloov ntawm cov hniav, qhov tshwm sim ntawm kev vibration thaum lub sij hawm siab -kev sib hloov ceev ntawm cov cuab yeej tuaj yeem txo qis rau qee yam, yog li txhim kho qhov kev ua tau zoo ntawm cov slotting thiab txo qhov loj ntawm qhov tawg ntawm ntug. Txawm li cas los xij, lawv tsis tau ua hauv - tshawb fawb tob.
Ib qho slicing, uas txhais tau hais tias tag nrho slicing lub silicon wafer nyob rau hauv ib tug mus, nrog ib tug slicing qhov tob ntawm 1/2 ntawm UV zaj duab xis thickness, raws li qhia nyob rau hauv daim duab 4. Txoj kev no muaj ib tug yooj yim tsim txheej txheem thiab yog haum rau txiav ultra- nyias cov ntaub ntawv. Txawm li cas los xij, thaum lub sij hawm txiav, cov cuab yeej txiav tau hnav hnyav heev, thiab cov npoo ntawm cov hniav txiav tuaj yeem ua rau chipping thiab microcracks, ua rau tsis zoo ntawm qhov chaw morphology ntawm cov npoo txiav.
Txheej txheej slicing txheej txheem, raws li qhia nyob rau hauv daim duab 5. Raws li lub thickness ntawm cov khoom txiav, ib txheej txheej pub yog siv rau kev txiav nyob rau hauv qhov tob kev taw qhia. Ua ntej, ua qhov slotting thiab txiav, siv qhov tob me me los xyuas kom meej tias cov cuab yeej raug quab yuam tsawg, txo cov cuab yeej hnav, thiab txo qhov kev txiav tawm. Tom qab ntawd, txiav mus rau qhov chaw uas UV zaj duab xis thickness yog 1/2.
