Cov khoom muag
Cov koob no yog cov khoom siv dav dav rau 6-8-inch wafers. HP 200 yog ib qho qauv tshwj xeeb rau 8-nti wafers, thiab HP300 / HP400 yog 6/8-nti ua qauv. Tag nrho peb cov qauv sib xyaw ua ke polishing, tu thiab EFEM integrated architecture, thiab tau nruab nrog lub siab-precision advanced txheej txheem tswj, npog tag nrho cov xwm txheej los ntawm cov khoom siv yooj yim polishing mus rau qhov tshwj xeeb planarization ntawm peb-tiam semiconductors thiab ntim siab heev. Qhov ntim ntawm cov txheej txheem tsim nyog wafers tshaj 400 lab daim.
Qhov zoo
General Core Advantages
1. Txais ib qho "Sry in and dry out" dry-hom integrated process architecture los txhim kho kev ua tau zoo thiab txo qhov kev pheej hmoo ntawm wafer paug.
2. Nruab nrog eddy tam sim no / laser / lub cev muaj zog torque triple endpoint tswj, thiab PTPC thiab PPC systems kom ua tiav nanoscale polishing precision.
3. Ua kom pom tseeb hauv cheeb tsam tag nrho - chain adaptation, tag nrho cov khoom siv txawv teb chaws, nrog cov saw hlau thiab cov kev pab cuam teb ntau dua nyob rau hauv txoj kab nrog kev lag luam hauv tsev.
4. Tau tshaj ntau yam polishing pads thiab slurries, thiab tuaj yeem kho cov txheej txheem ceev ceev kom haum rau polishing xav tau ntawm ntau yam ntaub ntawv thiab kev sib txuas.
Qauv-Qhov zoo tshaj plaws
HP 200: Txais yuav lub taub hau classic 4-polishing + 3-platen architecture, tshwj xeeb uas tsim los rau 8-nti wafer pawg ntau lawm, thiab ua tau raws li cov txheej txheem kev ua haujlwm nyuaj ntawm tag nrho IC tsim khoom.
HP 300: Tus tswj kev sib xyaw ua ke tsim tau zoo heev txo qhov chaw hauv pem teb, txhawb cov platen kub tswj (<60℃), and adapts to the polishing needs of high-temperature sensitive third-generation semiconductors.
HP 400: Nruab nrog lub platen txias dej system thiab ib qho kev hloov pauv tsis siv neeg wafer, nrog WIW & WTW < 5%. CLC ntws tswj ua rau cov txheej txheem parameter hloov tau meej dua, thiab cov cuab yeej muaj qib siab dua ntawm automation.
Daim ntawv thov
1. Integrated circuit manufacturing: Ua tau raws li cov txheej txheem ntawm STI, ILD, hlau xaim thiab lwm yam txheej txheem hauv IC tsim, thiab tsim nyog rau polishing ntawm cov khoom tseem ceeb xws li oxides, silicon, tooj liab thiab tungsten.
2. Thib peb - tiam semiconductor ua: HP300/HP400 tau yoog raws li kev xav tau tshwj xeeb ntawm cov khoom siv xws li SiC thiab GaN.
3. Cov txheej txheem ntim khoom siab heev: Tag nrho cov kev txhawb nqa lub hom phiaj ntawm kev ntim khoom zoo xws li 2.5D / 3D interposers thiab polymers.
4. Loj - nplai wafer ua: tuaj yeem siv cov txheej txheem polishing tseem ceeb xws li Oxide, Cu, W, STI & Poly Silicon, thiab hloov mus rau loj - nplai wafer pawg ntau lawm kab.
Tsis muaj
|
Specifications |
HP 200 (8-nti tshwj xeeb) |
HP 300 (6/8-nti tau tshaj) |
HP 400 (6/8-nti tau tshaj) |
|
Adapted wafer loj |
8-nti (200mm) |
6/8 nti (150/200mm) |
6/8 nti (150/200mm) |
|
Core architecture |
4 polishing taub hau + 3 platens; Polisher + Cleaner + EFEM integrated architecture |
4 polishing taub hau + 3 platens; Polisher + Cleaner + EFEM integrated architecture; integrated maub los |
4membrane polishing taub hau; 3 platens (nrog rau cov dej txias); 270℃HS kev sib hloov; max . 4slurry kab |
|
Core txheej txheem tsim |
"Nyob rau hauv thiab qhuav tawm" CMP |
"Nyob rau hauv thiab qhuav tawm" CMP; platen kub xyuas (<60℃) |
Wafer pib-flipping (WR); nruab nrog tsis siv neeg wafer hloov module; CLC khiav tswj |
|
Uniformity index |
- |
- |
WIW & WTW < 5% |
|
Advanced txheej txheem tswj |
Eddy tam sim no / laser / lub cev muaj zog torque endpoint tswj; PTPC dynamic tswj; PPC integrated metrology system |
Eddy tam sim no / laser / lub cev muaj zog torque endpoint tswj; PTPC dynamic tswj; PPC integrated metrology system |
Kuv-scan/laser/motor torque endpoint control; CLC khiav tswj |
|
Cov haujlwm tseem ceeb |
Txhawb nqa planarization ntawm kev ntim khoom siab heev polymers |
Hloov mus rau thib peb - tiam cov khoom siv semiconductor xws li SiC thiab GaN; sib xws nrog ntau yam polishing pads thiab slurries |
Ntau-channel slurry faib; tiag -lub sij hawm platen kub saib xyuas; tsis siv neeg wafer hloov thiab flipping |
|
Cov txheej txheem kev them nqi |
Tag nrho cov txheej txheem xws li Oxide, Cu, W, STI & Poly Silicon |
Oxide, Cu, W, STI & Poly Silicon; cov txheej txheem tshwj xeeb rau thib peb - cov khoom siv semiconductor |
Oxide, Cu, W; cov txheej txheem tshwj xeeb rau kev ntim khoom qib siab / thib peb- tiam semiconductors |
FAQ
Q: Qhov ntau thiab tsawg wafer ua peb CMP qauv txhawb?
A: HP 200 yog rau 8-nti (200mm) wafers nkaus xwb; HP 300 / HP 400 yog sib xws nrog 6/8-nti (150/200mm) wafers.
Q: Dab tsi yog qhov tseem ceeb ntawm daim ntawv thov teb?
A: Integrated circuit manufacturing, thib peb- tiam semiconductor (SiC/GaN) ua thiab cov txheej txheem ntim siab heev.
Q: Dab tsi yog qhov tseem ceeb ntawm cov txheej txheem tswj kev muaj peev xwm ntawm koob?
A: Tag nrho cov qauv feature eddy tam sim no / laser / lub cev muaj zog torque triple endpoint tswj, nrog nanoscale polishing precision ntawm PTPC / PPC systems.
Q: Dab tsi yog qhov zoo ntawm txhua tus qauv?
A: HP 200: Classic 4-lub taub hau+3-platen rau 8-nti loj ntau lawm;
HP 300: Compact tsim nrog platen temp tswj (<60℃);
HP 400: WIW & WTW<5% with high automation (auto wafer transfer/flip).
Q: Cov koob no puas tuaj yeem hloov cov khoom siv CMP txawv teb chaws?
A: Yog lawm, nws ua tiav qhov chaw ua tiav tag nrho - cov saw hloov pauv thiab hloov pauv tag nrho cov khoom siv 8-inch CMP nrog kev lag luam ua tau zoo thiab tawm los.
Cim npe nrov: 8-nti cmp khoom, Tuam Tshoj 8-nti cmp khoom manufacturers, lwm tus neeg
