Cov khoom muag
MHS 100, tsim los ntawm Leuven Instruments, yog ib qho tshwj xeeb hlau hardmask etching system rau 12-inch IC kev lag luam. Nws muaj ICP etch chambers thiab ib qho kev hloov pauv, tsom mus rau TiN hlau hardmask qhib hauv cov txheej txheem rov qab-kawg tooj liab sib txuas (siab dua zaus). Nws tuaj yeem ua haujlwm ntawm nws tus kheej rau hardmask etching ntawm cov khoom siv thev naus laus zis sib txawv thiab tseem ua haujlwm raws li kev xaiv module rau MSE 100 kom paub txog kev sib xyaw ua ke ntawm cov hlau hardmask rau cov cuab yeej ua haujlwm.
Qhov zoo
Loj Ntau Lawm Adaptability
Tsim los rau 12-inch IC wafer pawg ntau lawm, nrog rau kev txheeb xyuas kev ruaj ntseg kom ua tau raws li qhov xav tau ntau dua hardmask etching.
Txheej txheem dav Compatibility
Txhawb TiN hardmask etching thiab SADP txheej txheem rau 55nm thiab qib siab thev naus laus zis.
Kev sib xyaw ua ke zoo nthuav dav
Saj zawg zog ua ke nrog LMEC-300™ rau "hardmask-functional txheej" integrated etching, txhim kho efficiency
Daim ntawv thov
Rov qab- kawg txheej txheem ntawm 12-nti IC
Daim ntawv thov tseem ceeb hauv TiN hlau hardmask qhib rov qab -kawg tooj liab interconnects .
Advanced tech node manufacturing
Haum rau IC ntau lawm ntawm 55nm thiab ntau tshaj tech nodes.
Emerging memory device fabrication
Muab cov kev daws teeb meem sib xyaw ua ke thaum ua ke nrog LMEC-300 ™.
Tsis muaj
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Qeb |
Paub meej |
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Wafer Compatibility |
Dedicated rau 12-nti (300mm) IC wafers, txuam loj ntau lawm kab yuav tsum tau |
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Chamber Configuration |
Nruab nrog inductively coupled plasma (ICP) etch chambers + hloov module, kom ruaj khov txheej txheem thiab wafer hloov |
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Target Materials & Txheej txheem |
Tsom ntsoov rau TiN hlau hardmask etching; tau tshaj cov txheej txheem SADP |
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Compatible Technology Nodes |
Txhawb nqa 55nm thiab cov thev naus laus zis siab tshaj plaws, ua tau raws siab -kawg IC tsim cov kev xav tau |
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Kev muaj peev xwm ua ke |
Kev xaiv module rau LMEC-300™, ua rau "hardmask-functional txheej" kev sib xyaw ua ke |
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Kev ua raws li kev lag luam |
Txais yuav cov khoom siv hluav taws xob ntau ntau- cov qauv tsim thiab cov tswv yim tsim, tsim rau 12-nti IC ntim ntau lawm |
FAQ
Q: Dab tsi wafer loj nws txhawb?
A: Dedicated rau 12-nti (300mm) IC wafers.
Q: Dab tsi yog nws txoj haujlwm tseem ceeb?
A: TiN hlau hardmask qhib hauv 12-inch IC back-end tooj liab interconnects.
Q: Cov tech nodes twg yog nws sib haum nrog?
A: 55nm thiab ntau dua thev naus laus zis nodes.
Q: Nws puas tuaj yeem koom ua ke nrog lwm lub tshuab?
A: Yog, nws yog ib qho kev xaiv module rau LMEC-300 ™ rau integrated etching.
Q: Nws puas txhawb nqa cov txheej txheem SADP?
A: Yog lawm, sib haum nrog tus kheej -txhim kho ob tus qauv (SADP) cov txheej txheem.
Cim npe nrov: Tuam Tshoj hard mask etching system manufacturers, lwm tus neeg
