Cov khoom muag
Cov khoom ntim Advanced Ntim Wafer Plating no yog txhua yam hais txog kev yoog raws thiab nrawm- nws tuav 6- ntiv tes rau 12-nti wafers, thiab koj tuaj yeem xaiv ntawm 2D lossis 3D teeb tsa (uas yog BDS 2D thiab BDS 3D, raws li). Nws tau tsim kom haum rau hauv kev ntim khoom siab heev thiab cov txheej txheem wafer-theem, txawm tias koj txoj kab xav tau.
Sab hauv, nws tau ntim nrog cov khoom kom muaj kev nkag siab siab: mus txog 3 qhov chaw nres nkoj, 24 plating chambers (lawv ua haujlwm nrog Cu, Ni, Sn, Ag, Au-npe cov hlau), 4 pre-chamber ntub dej, thiab 4 SRD chambers. Txhua yam koj xav tau rau kev ua haujlwm du, tsis muaj kev cuam tshuam yog nyob ntawd.
Dab tsi ua rau nws ntseeg tau? Cov qauv tsim ntse ntse-ntug- hom plating hlwb ua kom cov kab mob tsis zoo, thiab cov qauv PM qauv txhais tau tias tsawg dua rau kev saib xyuas. Ntxiv rau, cov thev naus laus zis tshwj xeeb zoo li kev tswj nruj nruj thiab cathode / anolyte sib cais? Lawv kaw nyob rau hauv cov txheej txheem stability, yog li txhua batch los tawm zoo ib yam.
Qhov zoo
Wide Wafer & Material Compatibility
Txhawb 6-12-nti wafers; daim hlau ntau yam (Cu/Ni/Sn/Ag/Au) los npog ntau yam txheej txheem xav tau.
High Scalability & Tshaj
Configurable mus txog 24 plating chambers + 3 load ports, txuam siab - ntim ntau lawm xav tau.
Tus nqi qis ua haujlwm & siab ruaj khov
Ultra- siv tshuaj lom neeg tsawg + ntev - thev naus laus zis foob (20000+ cycles) txo cov nqi khiav.
Fountain- hom cell (tsis muaj kev sib kis -kev sib kis) thiab cathode/anolyte sib cais kom plating kev ruaj ntseg.
Siab Uptime
Module PM tsim minimizes txij nkawm downtime, haum rau nruam ntau lawm.
Qhov zoo
Core Fields:Semiconductor advanced ntim, wafer - qib ntim (WLP).
Cov txheej txheem tseem ceeb:Pillar (pillar bump), Bump (solder bump), RDL (redistribution layer), TSV (los ntawm -} silicon ntawm) cov txheej txheem electroplating.
Tsis muaj
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Specification |
Paub meej |
|
Wafer Loj |
6-12 nti |
|
Configurations |
VMAX 2D, VMAX 3D |
|
Load Ports |
Qhov siab tshaj plaws ntawm 3 qhov chaw nres nkoj |
|
Cov txheej txheem Chambers |
-Txog 24 plating chambers (Cu, Ni, Sn/Ag, Au) |
|
Cov yam ntxwv tseem ceeb |
-Funtain- hom plating cell (tsis muaj kev sib kis - paug) |
|
Kev Ua Haujlwm Zoo |
Ultra- siv tshuaj lom neeg tsawg; siab daws stability |
|
Daim phiaj siv |
Pillar, Bump, RDL, TSV (advanced/wafer{0}}theem ntim) |
FAQ
Dab tsi wafer loj npaum li cas BDS series txhawb?
Nws yog sib xws nrog 6-12-nti wafers, npog ob qho tib si me thiab loj rau kev ntim cov txheej txheem.
Dab tsi yog qhov txawv ntawm BDS 2D thiab 3D?
Lawv muab cov haujlwm tseem ceeb (plating rau Pillar/Bump/TSV, thiab lwm yam)- 3D configuration yog optimized rau siab dua -throughput los yog ntau complex 3D ntim txheej txheem (piv txwv li, advanced TSV).
Cov hlau twg tuaj yeem ua phaj?
Nws txhawb electroplating ntawm Cu, Ni, Sn / Ag, thiab Au, txuam ntau yam khoom ntim khoom xav tau.
Yuav ua li cas kom tsis txhob hla - kis kab mob?
Nws siv tus ciav dej- hom plating cell tsim, uas tiv thaiv kev sib kis ntawm cov txheej txheem sib txawv.
Lub neej ua haujlwm ntawm nws cov khoom foob yog dab tsi?
Lub tshuab foob tshwj xeeb tswj xyuas kom muaj lub neej foob ntawm ntau dua 20,000 lub voj voog, txo cov nqi tu.
Nws puas tuaj yeem ua haujlwm siab - ntim ntau lawm?
Yog-nrog txog li 24 plating chambers thiab 3 qhov chaw nres nkoj, nws yog tsim los rau siab -throughput nruam manufacturing.
Cim npe nrov: Tuam Tshoj advanced ntim wafer plating khoom, Tuam Tshoj advanced ntim wafer plating khoom manufacturers, lwm tus neeg
