Hauv kev tsim khoom semiconductor, Rapid Thermal Processing (RTP) iav ua los yog tawg wafer tawm los thiab cov txheej txheem sib xws. Tsis siv neeg RTP Cov Khoom Siv Hluav Taws Xob yog tsim los rau ntau lawm- ua haujlwm nrog 8-12 nti wafers, khiav tag nrho automated, thiab ua kom kub qhov chaw. Tab sis xaiv tus qauv zoo tsis yog ib txwm ncaj nraim, thiab kev txheeb xyuas yog tias nws haum rau koj qhov kev ua haujlwm tuaj yeem ua kom yuam kev. Cia peb rhuav nws hauv cov ntsiab lus yooj yim.
I. Peb kauj ruam yooj yim los xaiv tus qauv zoo
Kauj ruam 1: Pib nrog koj cov ntim ntau lawm (kab noj hniav + cassettes)
Ib leeg - kab noj hniav (RTP-200): 1 kab noj hniav, 2 cassettes, txheej txheem 5 wafers ib teev, thiab tsis tshua tawg (MTBF Ntau dua lossis sib npaug li 200 teev). Yog tias koj tab tom ua 100 lossis tsawg dua wafers ib hnub, lossis sim cov txheej txheem tshiab, qhov no yog thawj koom ruam ruaj khov- tau txais txoj haujlwm ua tiav yam tsis muaj nyiaj ntau.
Dual{0}}kab noj hniav (RTP-300): 2 kab noj hniav, 2-3 daim kab xev, thiab ntim ntau lub zog (txog 200Kw rau DTS-12 qauv). Zoo heev yog tias koj churning tshaj 100 wafers txhua hnub thiab xav tau kev tsim khoom tsis nres. Kev saib xyuas sai heev (MTTR Tsawg dua lossis sib npaug li 4 teev), yog li lub sijhawm poob qis tsawg.
Kauj Ruam 2: Sib piv cov ntsuas rau koj cov wafers thiab cov txheej txheem
Wafer loj: Tsis tas yuav hloov cov khoom siv yog tias koj txav los ntawm 8-inch mus rau 12-nti-tsuas yog tweak lub software. Super ke yog tias koj tab tom npaj yuav ntsuas tom qab.
Kub xav tau:
Tsawg-cov haujlwm kub (chav temp mus rau 800 degree): Siv cov thermocouples, ua kom temps zoo li ± 3℃-zoo rau qis- kev ntxhov siab annealing.
High -cov haujlwm kub (500-1250 degree): Relies ntawm pyrometers, nrog uniformity mus rau ± 0.5% saum 600℃. Tshav kub sai heev -150℃/s rau liab qab wafers-zoo meej rau ion implantation activation lossis nyias-film annealing.
Hom cab kuj: SiC cov neeg nqa khoom ntaus 20℃/ s, thaum SiC -coated graphite sawv daws mus txog 30℃/ s- xaiv dab tsi phim koj qhov teeb tsa.
Kauj ruam 3: Xyuas kom tseeb tias nws plays zoo nrog koj uas twb muaj lawm teeb
Cassette xaiv: Ua haujlwm nrog SMIF (kaw, plua plav-dawb) thiab Qhib Cassette (qhib, nkag tau yooj yim dua) cov tshuab- tsis tas yuav hloov kho koj qhov teeb tsa tam sim no.
Kev sib koom ua ke: Hooks txoj cai rau hauv koj EAP/MES software yam tsis muaj hassle. Ntxiv rau, koj tuaj yeem teeb tsa cov txheej txheem sib txawv rau wafers hauv tib lub cassette- muaj txiaj ntsig zoo yog tias koj ua me me -batch, kev cai khiav.
Kev nyab xeeb & traceability: Peb theem ntawm kev nkag mus rau cov neeg siv (ua kom cov ntaub ntawv ruaj ntseg), txuag tag nrho cov txheej txheem cov ntaub ntawv rau kev kuaj xyuas tom qab, thiab kaw yog tias muaj ib yam dab tsi mus tsis ncaj ncees lawm -xws li overheating, dej ntws, los yog lub siab tsis zoo. Ib qho - qhov tseem ceeb nres thaum muaj xwm ceev yog tus cawm seej, thiab wafer tawg yog tsawg heev (tsawg dua 1 ntawm 10,000).
II. Leej twg tau txais txiaj ntsig los ntawm cov cuab yeej no?
Nruab nrab-rau- cov tuam txhab loj semiconductor(ICs, fais fab semiconductors, compound semiconductors): Koj xav tau cov iav uas muaj kev ntseeg siab (uptime tshaj 92%), nyob twj ywm meej (temp repeatability ± 1 degree), thiab loj hlob nrog koj lub lag luam -qhov no khij tag nrho cov thawv ntawd.
Semiconductor ntim / kuaj cov tuam txhab: Wafer-theem ntim (WLP) lossis qhov system-hauv- pob (SiP) xav tau kev ua haujlwm zoo, zoo ib yam. Cov cuab yeej no tsis tshua muaj kev tawg thiab cov txheej txheem hloov tau yooj yim ua rau nws haum zoo.
High-cov khoom siv hluav taws xob kawg(SiC/GaN substrates, epitaxial wafers): Koj xav tau huv si, zoo li kub kub thiab ceev thermal mus. Nrog cov pa oxygen qis dua 1ppm, cov iav no ua rau koj cov ntaub ntawv ntshiab thiab siab - zoo.
III. Qhov twg Nws ua haujlwm zoo tshaj plaws
IC manufacturing: Ion implantation activation thiab silicide annealing -ob kauj ruam tseem ceeb uas tswj qhov kub tsis tuaj yeem tawm.
Kev tsim hluav taws xob semiconductor: Kov siab -kev kho cua sov rau SiC thiab GaN li, uas xav tau kev ua haujlwm nyuaj, meej.
Substrate / epitaxial wafer ua: Smooth tawm qhov tsis xws luag thiab txo kev ntxhov siab nyob rau hauv thib peb -gen semiconductor substrates thiab epitaxial wafers.
wafer- qib ntim: Txhim kho cov ntawv cog lus ntawm cov chips thiab wafers yam tsis muaj kev puas tsuaj rau cov khoom me me- txhua qhov kev siv, yog li tsis muaj tib neeg yuam kev.
Wrapping Up
Xaiv Cov Khoom Siv Tsis Siv Neeg RTP ua rau peb yam: phim cov kab noj hniav rau koj qhov ntim ntau lawm, tsis ua rau koj cov txheej txheem, thiab xyuas kom meej tias nws koom nrog qhov koj twb muaj lawm. Nws tsis yog ib qho -loj- haum-txhua lub cuab yeej, tab sis rau nruab nrab- mus rau- cov tuam txhab semiconductor loj, cov khw ntim khoom / kuaj, thiab cov khoom siv hluav taws xob, nws yog cov neeg ua haujlwm txhim khu kev qha-tshwj xeeb tshaj yog rau siab -precision}}, kev ua haujlwm ntau {{8} Yog tias koj tab tom hloov kho cov txheej txheem annealing, scaling, lossis tsuas yog xav tau kev sib xws, cov cuab yeej no tsim nyog saib ze dua.
